Prime Minister Narendra Modi and Uttar Pradesh Chief Minister Yogi Adityanath on Saturday, February 21, laid the foundation stone for a 3,700 INR-Crore semiconductor facility in Noida. The project marks a major investment under the state’s electronics manufacturing expansion.
The semiconductor unit will be developed by a joint venture between HCL Group and Foxconn. The facility will come up on an anticipated 48 Acres of land in the Yamuna Expressway Industrial Development Area. Moreover, the Noida semiconductor facility will focus on manufacturing display driver chips with a capacity of 20,000 wafers per month. These chips will be used in mobile phones, laptops, automobiles, and other electronic devices. The unit will further support domestic electronics manufacturing.
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The facility will add to semiconductor fabrication infrastructure in Uttar Pradesh. Moreover, it will strengthen the electronics manufacturing cluster emerging in the YEIDA region. The project represents a significant addition to the state’s semiconductor infrastructure pipeline.
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