The foundation stone for the 3D chip packaging unit was laid on Sunday, April 19, at Info Valley in Bhubaneswar, Odisha. The project is being developed by 3D Glass Solutions Inc, through its Indian subsidiary. It involves an estimated investment of 1,943 INR-Crore and marks India’s first advanced 3D semiconductor packaging facility.
The facility will use advanced 3D glass substrate technology for semiconductor packaging. It will manufacture around 50 Million assembled units annually, along with 70,000 glass panels and about 13,000 advanced modules. The project will support next-generation applications such as artificial intelligence and high-performance computing. Additionally, the plant will generate around 2,500 jobs and may expand capacity in future phases.
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Once operational, the Odisha 3D chip packaging unit will strengthen India’s semiconductor value chain. It will also position Odisha as a key hub for high-tech manufacturing and electronics infrastructure.
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Disclaimer: The information herein is based upon information obtained in good faith from sources believed to be reliable. All such information and opinions can be subject to change. Furthermore, the image featured in this article is for representation purposes only. It does not in any way represent the project. If you wish to remove or edit the article, please email editor@biltrax.com.
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